As we approach ISE, you'll likely hear about MIP pixel technology, or even see it on display.
As if it wasn't already confusing enough with SMD, Flip Chip, COB, MicroLED, 4in1 and now MIP!
This latest entry in LED Insights will (hopefully) equip you with the knowledge to ask the right questions, navigate the halls with confidence, and understand the key differences between SMD, COB MicroLED, and MIP.
Enjoy the show, and see you at ISE 2025!
MIP, short for "MicroLED in Package," is an advanced diode packaging technology that combines RGB diodes smaller than 100 microns into a surface mounted diode (SMD).
MIP shares many benefits with COB (Chip on Board) technology, but in this article, we will explore the key differences.
COB MicroLED: COB technology embeds RGB diodes directly into the substrate of the modules rather than mounting them in a package on the surface. The diodes are then encapsulated in resin, enhancing durability and aiding heat dissipation. The RGB diodes used in COB MicroLED technology are under 100 microns in size. (You can find out more about MicroLED here.)
MicroLED In Package (MIP): MIP technology utilises RGB diodes smaller than 100 microns, often integrating flip-chip and common cathode technologies. This enables pixel pitches as fine as 0.5mm to 2.0mm (sometimes larger). These diodes are then combined into a surface-mount package, which is mounted onto the PCB substrate. They are also typically encapsulated in resin to increase durability and aid heat dissipation.
1. Higher Brightness (NIT Output)
MIP displays can achieve higher brightness levels compared to COB, which is typically capped at 1,000 nits.
For instance, products such as our AEGIS Outdoor Kiosks use MIP technology to deliver brightness levels of up to 4,000 nits, making them suitable for outdoor or high-ambient light conditions.
2. Pixel Adaptability Across Multiple Pitches
MIP technology allows a single package to be adapted for various pixel pitches. For example, one MIP pixel can produce displays with pixel pitches ranging from P0.5 to P2.5 (see image below)
In contrast, traditional SMD technology is restricted to fixed pixel pitches determined by the package size, meaning each pitch uses a different sized pixel package. This obviously has negatives in terms of material usage, due to the number of extra components needed to hit a range of pitches but also in production times and cost.
3. Repairability
One significant drawback of COB technology is its lack of repairability—faulty or damaged pixels often require the full replacement of a module. To minimize waste, COB modules are typically smaller in size.
In contrast, MIP combines the benefits of COB with the repairability of traditional SMD displays, as the pixels are surface-mounted, making repairs possible.
4. Mass Transfer Technology
Mass transfer technology is crucial for scaling MicroLED displays using by enabling the simultaneous transfer of millions of tiny LEDs onto substrates. This high-throughput method significantly reduces manufacturing time and costs compared to traditional pick-and-place techniques. It also improves efficiency, lowers defect rates, and enhances production yield, making MicroLED more commercially viable.
5. Improved Energy Efficiency
MIP displays offer similar energy-saving properties as COB, achieving up to 40% energy savings compared to traditional legacy SMD displays.
However, it is important to compare energy consumption values between displays of the same brightness level and pixel pitch for accurate assessment.
6. Durability & Heat Dissipation
As mentioned earlier, MIP displays from LED Studio come with a protective resin coating as standard. This offers protection against splashes of liquid, as well as accidental and intentional impacts. Additionally, this coating acts as a heat sink, meaning MIP displays remain cool to the touch.
7. Image Quality
Thanks to the minuscule size of MIP pixels, manufacturers can more easily surround them with high-contrast materials. While the contrast levels may not reach those of COB displays, they are expected to surpass those of traditional SMD screen, sitting in the region of 25,000 - 100,000:1, depending on pixel pitch.
MIP LED displays can be used for almost all indoor applications, providing excellent performance for both close-up and long-distance viewing. Due to their increased NIT output, they are now being incorporated into a range of smaller form-factor outdoor LED displays (see AEGIS).
While we have yet to see many manufacturers using MIP in its raw form for outdoor applications, this is likely the next evolution—particularly for smaller, ground-level outdoor displays designed to compete with the clarity of LCD technology.
MIP LED technology is rapidly evolving, bridging the gap between COB and traditional SMD displays by offering high brightness, repairability, and adaptability across various pixel pitches. As manufacturers continue to refine mass transfer techniques and improve energy efficiency, MIP is poised to play a significant role in the future of LED displays—both indoors and outdoors. With its growing potential to rival COB in contrast and visual performance, industries such as cinema, broadcast, and high-end commercial displays may soon embrace MIP on a larger scale.
As we look ahead, it’s clear that MIP represents a pivotal innovation in LED display technology, paving the way for more efficient, durable, and versatile display solutions. Stay tuned for the next article from LED Insights as we continue to explore the latest advancements in LED technology.